Capabilities:
|
Materials Management:
|
Specializing in the manufacturing of PCBAs using fully automated state-of-the-art equipment, which maximizes quality and performance at lower manufacturing costs
Full capability for assembling SMT/SMD, Thru-Hole and Mixed Technology PCB assemblies
Latham Industries strength is blending mechanical design, printed circuit board layout, and embedded firmware/software to create high quality Printed Circuit Boards (PCBs) for simple and complex applications
Latham Industries team brings very experienced highly skilled professionals to solve customer needs and improve products
Latham Industries ensures efficient, cost effective designs completed on schedule, while meeting all of your design requirements
The more complex the board, the more dollars lost when scrapped
Most post-reflow damage occurs due to improper part removal techniques
Latham Industries can handle all component, BGA and other grid array device rework and repairs
With miniaturization and diversification of electronic components, Latham’s state-of-the-art equipment is poised to meet your needs of today and tomorrow.
• Laser solder paste monitor delivers a low-paste warning and stops when it is too low for reliable printing
• 3S (single swing squeegee) head to maintain paste volume consistency
• 2D inspection to ensure optimum print quality
• High-speed, multi-purpose head supports ultra-tiny chips of 0.3mm x 0.15mm (03015) to large components of 45mm x 100mm
• PCB support capability from 50mm x 50mm up to L810mm x W480mm
• Placement speeds up to 45,000 CPH
• In-Line, 2D inspection, high-speed, high-resolution 12 megapixel camera
• 4-directional angular camera for precise and efficient inspection
• True color inspection ensures color integrity
• Ten 12.5” zones can handle the most thermally challenging assemblies, including heavy multilayer PCBs and aluminum core boards
• Closed-loop convection control provides maximum flexibility in process control